On June 6th, 2019, the Ministry of Industry and Information Technology officially issued 5G commercial licenses to China Mobile, China Telecom, China Unicom and China Broadcast, marking that China officially entered 5G commercial year.
With the coming of the 5G era, the demand for communication-related PCBs soar and the drilling procedure becomes the new challenge of capacity, adding stacks and efficiency improvement are imperative! Compared to common PCBs, one of the remarkable features of the communication PCBs is thickness, and the technical requirements and process difficulty increase significantly, which asks for higher-aspect ratio and more stable drills.
Jinzhou has focused on high-aspect ratio drills for a long time. At present, Jinzhou is able to provide mature products for communication boards, package boards, and other common boards.
Application Case
Application case of communication boards
Target Board: High-speed board t5.00mm*1pnl
Tool: A129PD Φ 0.13x1.3mm
SHC AUSF Φ 0.13x3.5mm
Auxiliary Material: LExR07F2 entry baord, Melamine backup board
Performance:
Through pre-drilling and flip drilling, greatly improves the hole registration accuracy and reduces the deviation, the broken rate and the hole wall quality meet the customer's demand.
Application case of Auto boards
Target Board: SY S1141 6layers t1.60mm*3pnl
Parameter: S180krpm F40mm/s H1800
Tool: USFΦ0.25-6.2
Entry Board: lubricant entry board
Performance:
Hole Registration Accuracy Cpk(±3mil)
Hole Wall Quality
Hole Wall Roughness
Nail Heading
For processing auto boards, Jinzhou’s ultra-high aspect ratio drills can achieve stacks adding, promise outstanding quality, improve drilling efficiency greatly and reduce manufacturing cost.
Jinzhou, with professional technology and great quality, is waiting for providing stack-adding and efficiency-improving overall solutions for 5G and common boards for you!