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Package substrate adding layers

2019-07-25

With the development of electronic circuit industry, demand for layer addition in the drilling of package substrate appears. In order to reduce the drilling cost, we request for more and more layers and longer processing life of drills.

Now, for 0.41mm thick MCL-E-700GR board, the 0.1mm mechanical drilling can only process 2 pieces per stack, and the service life is 8,000 holes. However, SHC AUSF 0.11x2.2mm coated bit developed by Jinzhou can achieve 3 pieces per stack and increase its life to 10,000 holes, which improves the production efficiency and reduces the cost significantly.


Processing Case

Target Board: MCL-E-700GR T0.41mm*3pnl

Tool: JINZHOU’s SHC AUSF 0.11x2.2

Parameter: S190krpm F2.10m/min U25.40m/min   


1. Hole Registration Accuracy(±40um)

We can see from the following figure that while processing 10,000 holes, the CPK of new bits and bits repointed within 3 times are ≥ 1.67, and the overall hole registration is good, which can meet the needs of customers.


Jinzhou’s double-edge single-flute drill (USF series) possesses    good rigidity and chip evacuation capacity, together with super-lubricant coating can maintain excellent hole registration accuracy.

2. Wearing

As the following figures, while processing 10,000 holes, the wearing of Jinzhou’s new bits and bits repointed within 3 times is really slight.



3. Conclusion

Jinzhou‘s double-edge single-flute drill together with special coating SHC, is able to process 3 pieces per stack while drilling package substrate, and life can reach 10,000 holes, which meets the quality needs, improves manufacturing efficiency greatly. Your choice to be the best!



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